Material quality improvements for high voltage 4H-SiC diodes

Citation
E. Kalinina et al., Material quality improvements for high voltage 4H-SiC diodes, MAT SCI E B, 80(1-3), 2001, pp. 337-341
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
09215107 → ACNP
Volume
80
Issue
1-3
Year of publication
2001
Pages
337 - 341
Database
ISI
SICI code
0921-5107(20010322)80:1-3<337:MQIFHV>2.0.ZU;2-4
Abstract
The influence of thin 4H-SiC buffer layers grown by liquid phase epitaxy (L PE) on structural quality of 4H-SiC low-doped epitaxial layers, grown by ch emical vapor deposition (CVD) was investigated in detail. A dramatic defect density reduction in CVD epitaxial layers grown on commercial wafers with buffer LPE layer was detected. P(+)n junctions were formed on these CVD lay ers by high dose Al ion implantation followed by rapid thermal anneal. It w as shown that both the increase of diffusion lengths of minority carriers ( Lp) in CVD lavers and the forming of p(+)-layers after Al ion implantation and high temperature anneal lead to superior device characteristics. (C) 20 01 Elsevier Science B.V. All rights reserved.