N. Ide et al., Evaluation of microplastic flow stress in copper alloys from amplitude-dependent internal friction, MATER TRANS, 42(3), 2001, pp. 435-438
Stress-strain relations are evaluated from amplitude-dependent internal fri
ction in polycrystalline solid solution copper alloys. The Row stress in mi
croplastic strain range much below the yield point is examined for eight ki
nds of specimens, prepared by alloying commercial-grade pure copper with 0.
3 at% solute atoms (aluminum, silicon, nickel, gallium, germanium, indium,
tin and gold). Internal friction is measured at room temperature under atmo
spheric pressure using the free-decay method of flexural resonant vibration
with both free ends around 600 Hz. The Row stress of Cu-Sn alloys required
to cause the plastic strain of 1 x 10(-9) is about 440 times larger than t
hat of pure Cu, while that of Cu-Ni alloys only 6 times larger. Thus the ho
w stress evaluated from amplitude-dependent internal friction reflects sens
itively the change of solute elements. The Row stress is examined in terms
of the misfit parameters between solute and solvent atoms proposed by Fleis
cher, and it is shown that the flow stress in microplastic strain range is
controlled by the elastic interactions between screw dislocations and solut
e atoms in solid solution copper alloys.