Low frequency, 1/f, noise of the drain current, I-D, fluctuations was measu
red on a series of Si MOSFETs with the gate oxide thickness, t(ox), varied
from 25 to 40 Angstrom by steps of 5 Angstrom. The salient point of this wo
rk is a demonstration that, at sufficiently low I-D, intensities, a mean lo
w noise level in the MOSFETs is reduced as the gate oxide becomes thinner.
This is explained assuming that the noise originates from the electron capt
ure/release on Si/SiO2 interface/border traps. The flat band voltage fluctu
ations, observable as noise, are linked then to the oxide charge fluctuatio
ns by a factor, that is inversely proportional to the gate capacitance, C-o
x, and thus proportional to t(ox). At higher I-D, the results are more comp
licated, as the access resistance noise is also involved. We provide an int
erpretation of the ensemble of the data and show that the noise analysis ca
n furnish quantitative estimates of several device characteristics. Device
degradation and its consequences for the low frequency noise at higher curr
ent levels are also discussed. (C) 2001 Elsevier Science Ltd. All rights re
served.