A hybrid bulk/silicon-on-insulator (SOI) complementary metal oxide semicond
uctor (CMOS) active pixel image sensor has been fabricated and studied. The
active pixel comprise of reset and source follow transistors on the SOI th
in film while the photodiode is fabricated on the SOI handling substrate af
ter removing the buried oxide. The hulk photo diode can be optimized for ef
ficiency with the use of lightly doped SOI substrate without compromising B
e circuit performance. On the other hand, the elimination of wells on the S
OI thin-film allows the use of PMOSFET without increasing the pixel size, T
he addition of a PMOSFET in the active pixel structure can reduce the minim
um operating voltage of the circuit beyond that of conventional designs. Wi
th the combination of the high quantum efficiency of bulk photodiode and th
e low power advantage of SOI technology, the hybrid technology is attractiv
e, for scaled low voltage imaging applications.