Selective area mass transport regrowth of GaN was performed on wafers with
etched wells and SiO2 mask. The samples were annealed in NH3 and H-2 flow,
with no gallium precursor. At 1060 degreesC, only little mass transport occ
ured, but the sidewall morphology changed, depending on crystallographic or
ientation At 1160 degreesC, the sidewalls grew out about 1 mum in 1 min, in
dependent of orientation. The technique can potentially be performed in an
annealing chamber, providing a low cost regrowth process. A promising appli
cation is ohmic contact regrowth to high composition AlGaN/GaN high electro
n mobility transistors.