Electrochemistry of hypochlorite at silicon in alkaline etchants - Applications in device fabrication

Authors
Citation
Xh. Xia et Jj. Kelly, Electrochemistry of hypochlorite at silicon in alkaline etchants - Applications in device fabrication, J ELCHEM SO, 148(5), 2001, pp. C348-C352
Citations number
21
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
148
Issue
5
Year of publication
2001
Pages
C348 - C352
Database
ISI
SICI code
0013-4651(200105)148:5<C348:EOHASI>2.0.ZU;2-A
Abstract
Electrochemical reduction of hypochlorite (OCl-) at silicon in alkaline sol ution occurs via a two-step mechanism. The first step involving a conductio n band electron gives an intermediate which subsequently injects a hole int o the valence band. As a result, photocurrent doubling is observed with the p-type semiconductor. OCl- reacts chemically with silicon at a rate which is constant for potentials more negative than the open-circuit value. It is shown that OCl- can be used to control the surface morphology of silicon d uring chemical etching in alkaline solution. In addition, OCl- is a suitabl e oxidizing agent for achieving a galvanic etch stop in beam and membrane f abrication. (C) 2001 The Electrochemical Society. [DOI: 10.1149/1.1359203] All rights reserved.