Xh. Xia et Jj. Kelly, Electrochemistry of hypochlorite at silicon in alkaline etchants - Applications in device fabrication, J ELCHEM SO, 148(5), 2001, pp. C348-C352
Electrochemical reduction of hypochlorite (OCl-) at silicon in alkaline sol
ution occurs via a two-step mechanism. The first step involving a conductio
n band electron gives an intermediate which subsequently injects a hole int
o the valence band. As a result, photocurrent doubling is observed with the
p-type semiconductor. OCl- reacts chemically with silicon at a rate which
is constant for potentials more negative than the open-circuit value. It is
shown that OCl- can be used to control the surface morphology of silicon d
uring chemical etching in alkaline solution. In addition, OCl- is a suitabl
e oxidizing agent for achieving a galvanic etch stop in beam and membrane f
abrication. (C) 2001 The Electrochemical Society. [DOI: 10.1149/1.1359203]
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