Rapid prototyping of masks for through-mask electrodeposition of thick metallic components

A flexible and inexpensive approach for rapid prototyping of thick masks (s imilar to 130 mum in height) for through-mask electrodeposition of metallic microstructures is demonstrated. The electrodeposition masks are fabricate d directly from a computer-aided design layout by patterning adhesive-backe d polyvinyl chloride tape using a CO2 laser. The pliant tape masks can then be transferred directly to planar or nonplanar substrates. We demonstrate the use of the tape mask on a nonplanar substrate by plating a NiFe microco il on a cylindrical rod. The pattern transfer characteristics of the tape m ask are illustrated by plating copper columns on a platinum rotating disk e lectrode. We also fabricate a two-level NiFe criss-cross structure to show how these tape masks can be used to build structures in three dimensions. L imitations of the existing laser system permit minimum lateral feature dime nsions of 130 mum, though the method developed here should readily scale do wn in feature dimensions using a higher energy pulsed laser. (C) 2001 The E lectrochemical Society. [DOI: 10.1149/1.1360187] All rights reserved.