A non-aqueous, electroless, polyol process was used to deposit nanostructur
ed NixCo100-x films on Cu substrates by reducing nickel acetate and cobalt
acetate in refluxing ethylene glycol at 194 degreesC for 1 h, as-deposited
films were characterized using X-raf diffraction (XRD), scanning electron m
icroscopy (SEM), vibrating sample magnetometry (VSM). microhardness and mic
roscratch tests. The films had a (111) texture and the average crystallite
size increased with x from 15 to 63 nm. The films show in-plane magnetizati
on anisotropy. Saturation magnetization (M-s) increased with increasing Co
concentration and reached 1421 emu/cm(3) for Co-100. The perpendicular coer
civity (H-c perpendicular to) was higher than that in-plane (Hc//). The Ni5
0Co50 film had the highest H-c perpendicular to and microhardness compared
to other films of different compositions. The critical load fur delaminatio
n increased with x and was independent of him thickness;. In this polyol pr
ocess film deposition on the substrate competed with undesirable powder pre
cipitation in the solution. Lowering the reaction temperature did not favor
film deposition. However, film deposition occurred when an electric field
was applied during the reaction at temperature as low as 100 degreesC. Prec
ipitation of colloidal particles persisted at this low temperature in a dif
ferent dial. (C) 2001 Elsevier Science B.V. All rights reserved.