A melt encasement (fluxing) technique has been used to systematically study
the velocity-undercooling relationship and microstructural development in
samples of Cu-O and Cu-3 wt.% Sn at undercoolings up to 250 K. Both systems
experience spontaneous grain refinement at high undercooling, but there ar
e sufficient microstructural differences to suggest the mechanisms operatin
g are different. In Cu-Sn grain refinement appears to be a consequence of r
ecrystallisation, whereas in Cu-O a dendrite fragmentation process may have
occurred. (C) 2001 Elsevier Science B.V. All rights reserved.