Effects of manufacturing parameters on the linear expansion of densified wood composite panels II. Effect of board density, resin type and resin content on linear expansion of particleboard
A. Suematsu et al., Effects of manufacturing parameters on the linear expansion of densified wood composite panels II. Effect of board density, resin type and resin content on linear expansion of particleboard, MOKUZAI GAK, 47(2), 2001, pp. 129-137
The objective was to determine the relationship between the variables board
density, resin type, and resin content and the dimensional stability prope
rties of particleboard. Manufactured boards were exposed to three levels of
relative humidity (RH) and to a vacuum-water-soak treatment. Changes in mo
isture content (MC), linear expansion (LE), and thickness swelling (TS) wer
e measured. Results obtained are summarized as follows.
1) Equilibrium moisture content (EMC) decreased as board density and resin
content increased at all levels of exposure. EMC of methylene diphenyl diis
ocyanate (MDI) resin board showed the lowest value and phenol-formaldehyded
e (PF) resin board showed the highest value at the 95% RH exposure level.
2) Increases in board density increased LE per unit of moisture content cha
nge (LE/MC) and TS per unit of moisture content change (TS/MC). The influen
ce of resin type on LE/MC was not clear at 66% RH, but at 95% RH, PF showed
the lowest value of LE/MC. Decreases in resin content increased TS, howeve
r LE tended to decrease slightly.
3) Multiple regression analysis shelved that LE/MC could be predicted with
TS/MC, board density, and internal bond strength (IB) as the explanatory va
riables.
4) When exposed to an alternate vacuum-water soak and oven-drying treatment
, TS increased, however LE decreased with increasing number of cycles, exce
pt for the urea-formaldehyde (UF) board. Except for the UF board, the board
length in the dry condition gradually became less than the initial length.
PF resin showed superior dimensional stability.