Quantitative modeling of diffusional coarsening in eutectic tin/lead solders

This paper presents a quantitative computer simulation of the coarsening ph enomenon observed in eutectic tin/lead and other solder materials used for joining microelectronic components. The mathematical model is based on phas e field theory and allows predicting the development of tin concentration o ver time within a Representative Volume Element (RVE) of the solder. It acc ounts for the chemical free energy of the various phases, their surface ene rgies as well as locally acting thermo-mechanical stresses and strains. All material parameters required stem from the literature and are based on exp eriments performed independently of the coarsening phenomenon and the model of this paper.