Copper bump bonding with electroless metal cap on 3 dimensional stacked structure

CBB, the copper bump bonding process could perform the flip-chip bonding in 100 mum pitch with electroless metal cap on the surface, leading to the in terconnections of the copper through-hole electrodes on 3 dimensional stack ed structure. In this paper, the results of the technical studies on the both of the elec troless plating process and the thermo-compressive bonding are introduced, which are the key technologies for the interconnections expand to the inter connections in 20 mum pitch to realize the advanced 3D stacked structure.