This paper uses CFD (Icepak) to identify a cooling solution for a desktop c
omputer, which uses an 80 W CPU. The design is based on a total chassis pow
er dissipation of 313 W (40 W PCI cards). This represents significant power
dissipation for the chassis components (memory, chipset, AGP and PCI cards
, and peripherals). The analysis is also extended to 100 W PCI power. Of ke
y interest is minimization of the chassis air flow requirements. The design
is able to cool the chassis with one case fan and the power supply fan. A
ducted 80 x 60 mm CPU heat sink is able to meet the CPU temperature specifi
cation. System level design improvements were made to provide better coolin
g for AGP and PCI cards.