High resolution thermal images of semiconductor micro refrigerators are pre
sented. Using the thermoreflectance method and a high dynamic range PIN arr
ay camera, thermal images with 50mK temperature resolution and high spatial
resolution are presented. This general method can be applied to any integr
ated circuit, and can be used as a tool for identifying fabrication failure
s. With further optimization of the experimental setup, we expect to obtain
thermal images with sub-micron spatial resolution.