A generic method for thermal multiport model generation of IC packages

The dynamic thermal behaviour of electronic subsystems is characterised by their dynamic compact models. These models have to be similar to the steady state models in describing the fact that the heat is usually leaving on di fferent locations (ports), necessitating multi-port description of the ther mal behaviour. In our paper we present a method suitable for direct generat ion of multi-port dynamic compact thermal models from a series of thermal t ransient simulations or measurements. The generated RC electrical equivalen t circuit model, exercised with a network simulator program provided the sa me transient functions as the simulated ones for various boundary condition s, proving the accuracy of the method. Measurement results are also suitabl e to the compact model generation.