The study of micro-fin heat sinks for electronic cooling applications

A variety of pin fin parameters were studied and tested to calculate an emp irical relation, which can predict the optimum thermal performance of micro pin fin structure. The sample parameters we have tested are as follows: 1. Fin size is from 0.2mm to 1.0mm. 2. Fin height is from 2.0mm to 10.0mm. The errors compare with the empirical relation and the test data are less t han 5%, so we can use this empirical relation to estimate the optimum perfo rmance of pin fin heat sinks. According to the result from empirical relati on, we knows the ratio of optimum fin pitch to fin size (fin pitch /fin siz e) is about 1.5 similar to 1.7. Higher fin height can get higher thermal pe rformance, and tinier fin size structure has potential to make better therm al performance than huge fin size structure.