Electrodeposition of Cu-Re alloy thin films

Citation
R. Schrebler et al., Electrodeposition of Cu-Re alloy thin films, THIN SOL FI, 388(1-2), 2001, pp. 201-207
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
388
Issue
1-2
Year of publication
2001
Pages
201 - 207
Database
ISI
SICI code
0040-6090(20010601)388:1-2<201:EOCATF>2.0.ZU;2-8
Abstract
The electrodeposition of copper-rhenium alloys from Cu(II) and Re(IV) solut ions was studied in an aqueous H,SO, matrix. Different substrates have been used (glassy carbon, titanium and gold), and the effect of them on the ele ctrochemical behavior of the studied ions is shown. Cyclic voltammetry was used in conjunction with oscillating quartz crystal nanogravimetry to delin eate features in the voltammograms accompanied by mass loss or gain at the electrode surface, from those attributable to the solution phase. The obtai ned Cu-Re films were subjected to scanning electron microscopy (SEM). energ y dispersive X-ray analysis (EDX) and X-ray diffraction analysis (XRD). The rhenium content increases as the potential was made more cathodic, reachin g a maximum value of 10% atomic composition. The films were amorphous with a cauliflower structure. (C) 2001 Published by Elsevier Science B.V. All ri ghts reserved.