On the determination of energy fluxes at plasma-surface processes

A summary is given of different methods for the determination of the energy influx and its influence on the thermal balance and energetic conditions o f substrate surfaces during plasma processing. The discussed mechanisms inc lude heat radiation and kinetic and potential energy of charged particles a nd sputtered neutrals. For a few examples such as magnetron sputtering of a -C:H films, sputter deposition of aluminum on microparticles, and titanium deposition in a hollow-cathode are evaporation device the energetic balance of substrates during plasma processing is presented.