Contamination of silicon surface due to contact with solid polymers

Citation
N. Iyer et al., Contamination of silicon surface due to contact with solid polymers, IEEE SEMIC, 14(2), 2001, pp. 85-96
Citations number
16
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
ISSN journal
08946507 → ACNP
Volume
14
Issue
2
Year of publication
2001
Pages
85 - 96
Database
ISI
SICI code
0894-6507(200105)14:2<85:COSSDT>2.0.ZU;2-X
Abstract
The present research investigates material transfer associated with the con tact between polymers and silicon surfaces. Material transfer from a variet y of solid polymers (UHMWPE, Teflon, KEL-F, PMMA, Nylon 66, and PEEK) was s tudied and characterized by optical microscopy, scanning electron microscop y, atomic force microscopy, and by computer image analysis. Experimental re sults suggest that material transfer is affected by the Hertz contact area, The number of particles and the total particle area increase with an incre ase in load and a decrease in the Young's modulus, Also, material transfer increases when the contacting surfaces are rougher. Friction appears to be a weak parameter in the material transfer phenomenon. Additionally, hardnes s is significant only when normal loading is great enough to initiate plast ic deformation in the polymer.