The present research investigates material transfer associated with the con
tact between polymers and silicon surfaces. Material transfer from a variet
y of solid polymers (UHMWPE, Teflon, KEL-F, PMMA, Nylon 66, and PEEK) was s
tudied and characterized by optical microscopy, scanning electron microscop
y, atomic force microscopy, and by computer image analysis. Experimental re
sults suggest that material transfer is affected by the Hertz contact area,
The number of particles and the total particle area increase with an incre
ase in load and a decrease in the Young's modulus, Also, material transfer
increases when the contacting surfaces are rougher. Friction appears to be
a weak parameter in the material transfer phenomenon. Additionally, hardnes
s is significant only when normal loading is great enough to initiate plast
ic deformation in the polymer.