Delamination of a strong film from a ductile substrate during indentation unloading

Citation
A. Abdul-baqi et E. Van Der Giessen, Delamination of a strong film from a ductile substrate during indentation unloading, J MATER RES, 16(5), 2001, pp. 1396-1407
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
16
Issue
5
Year of publication
2001
Pages
1396 - 1407
Database
ISI
SICI code
0884-2914(200105)16:5<1396:DOASFF>2.0.ZU;2-V
Abstract
In this work, a finite element method was performed to simulate the spheric al indentation of a ductile substrate coated by a strong thin film. Our obj ective was to study indentation-induced delamination of the film from the s ubstrate. The film was assumed to be linear elastic, the substrate was elas tic-perfectly plastic, and the indenter was rigid. The interface was modele d by means of a cohesive surface. The constitutive law of the cohesive surf ace included a coupled description of normal and tagential failure. Crackin g of the coating itself was not included. During loading, it was found dela mination occurs in a tangential mode rather than a normal one and was initi ated at two to three times the contact radius. Normal delamination occurred during the unloading stage, where a circular part of the coating, directly under the contact area was lifted off from the substrate. Normal delaminat ion was imprinted on the load versus displacement curve as a hump. There wa s critical value of the interfacial strength above which delamination was p revented for a given material system and a given indentation depth. The ene rgy consumption by the delamination process was calculated and separated fr om the part dissipated by the substrate. The effect of residual stress in t he film and waviness of the interface on delamination was discussed.