Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: Dependence on advanced electronic packaging to achieve full performance

A revolution is occurring in several device and integrated circuit technolo gies (silicon CMOS and its extensions such as silicon germanium and silicon on insulator [SOI], and the so-called III-V compound semiconductors includ ing indium phosphide and gallium arsenide), as well as in solid-state senso rs such as infrared detectors enabled by the new materials and devices. The se new components are being used to enhance the performance of many systems , and even to create systems never before available, of present interest to the U.S. Department of Defense and of likely near-term interest to parts o f the commercial electronics industry such as the landline, wireless, and s atellite telecommunications industry. These new components require advanced electronic packaging that does not restrict or degrade their performance. Unfortunately, largely due to commercial cost pressures, research in and sm all-lot manufacture of high-performance packaging though still feasible and not lacking for good ideas for possible enhancement, are no longer being a ctively pursued either by the principal U.S. government agencies (e.g., DAR PA, Air Force), by the commercial electronic packaging industry, or by comm ercial consortia such as the Microelectronics and Computer Technology Corpo ration (defunct as of June 2000), Semiconductor Research Corporation (SRC), or Sematech Inc. [1], [2]. This paper discusses recent examples of high-pe rformance components and integrated circuit technologies and describes how they are being exploited in new or upgraded systems. Advances in packaging technology that will be required to support the new integrated circuits are also described. In conclusion, several possible approaches are reviewed by which the United States can regain momentum in the development of performa nce-driven packaging technologies.