The intermetallic phases formed between solid nickel and molten alumin
ium have been studied under isothermal conditions. For temperatures ra
nging from 695 to 800 degrees C, the interfacial microstructure consis
ted of two phase layers, Al3Ni2 and Al3Ni. It was found that the phase
growth was diffusion controlled. The identified compounds, which coin
cide with the Al-rich phases of the Al-Ni phase diagram, have the high
est interdiffusion coefficients. The observation of these phases was w
ell linked with the thermodynamic behaviour of the melt, in agreement
with the associate model applied to liquid alloys. The calorimetric ex
periments have indicated a negative curvature for the enthalpies of di
ssolution of Ni, which is consistent with the formation of transitory
compound layers at the solid-liquid interface. Moreover, it was found
that the dissolution time of Ni increased when interfacial compound la
yers were formed.