New developments in thermal wave microscopy

Citation
J. Pelzl et al., New developments in thermal wave microscopy, ANAL SCI, 17, 2001, pp. S53-S56
Citations number
11
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences
Journal title
ANALYTICAL SCIENCES
ISSN journal
09106340 → ACNP
Volume
17
Year of publication
2001
Pages
S53 - S56
Database
ISI
SICI code
0910-6340(2001)17:<S53:NDITWM>2.0.ZU;2-R
Abstract
Near field scanning thermal wave microscopes which offer lateral resolution in the submicron range are either based on the detection of the thermoelas tic response or a thermal probe is used. Recently we have shown that the sc anning thermo-elastic microscope provides a means to measure simultaneously topological and thermal structures. In this report the signal generation p rocess is investigated in detail for the microscope applied to an electrica lly heated semiconductor devices such as an in-plane-gate transistor and a non-conduction line on a mesa. Additional contributions to the signal consi dered comprise electrostatic effects, heating of the tip and piezoelectric deformations. Introducing a calibration method a quantitative information o f the local thermo-elastic expansion of the surface is obtained from which the temperature distribution is deduced by a finite element calculation. Co mbined optical and electrical heating provides a means to imagine also buri ed structures such as insulating lines produced by focused ion beams.