Stress engineering during metalorganic chemical vapor deposition of AlGaN/GaN distributed Bragg reflectors

Citation
Ke. Waldrip et al., Stress engineering during metalorganic chemical vapor deposition of AlGaN/GaN distributed Bragg reflectors, APPL PHYS L, 78(21), 2001, pp. 3205-3207
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
78
Issue
21
Year of publication
2001
Pages
3205 - 3207
Database
ISI
SICI code
0003-6951(20010521)78:21<3205:SEDMCV>2.0.ZU;2-F
Abstract
In situ stress monitoring has been employed during metalorganic chemical va por deposition of AlGaN/GaN distributed Bragg reflectors (DBRs). It was fou nd that the insertion of multiple AlN interlayers is effective in convertin g the tensile growth stress typically observed in this system into compress ion, thus alleviating the problem of crack generation. Crack-free growth of a 60 pair Al0.20Ga0.80N/GaN quarter-wavelength DBR was obtained over the e ntire 2 in. wafer; an accompanying reflectivity of at least 99% was observe d near the peak wavelength around 380 nm. (C) 2001 American Institute of Ph ysics.