SiC active layers of tailored thickness and doping form the heart of a
ll SIC electronic devices. These layers are most conveniently formed b
y vapor phase epitaxy (VPE). Exacting requirements are placed upon the
SiC-VPE layers' material properties by both semiconductor device phys
ics and available methods of device processing. In this paper, the cur
rent ability of the SiC-VPE process to meet these requirements is desc
ribed along with continuing improvements in SiC epitaxial reactors, pr
ocesses and materials.