Fx. Lu et al., Accurate measurement of strength and fracture toughness for miniature-sizethick diamond-film samples by three-point bending at constant loading rate, DIAM RELAT, 10(3-7), 2001, pp. 770-774
Fracture strength and fracture toughness (K-CI) of miniature-size thick fre
estanding diamond film samples were accurately measured by three-point bend
ing at a constant loading rate. A specially designed testing rig, capable o
f achieving a constant loading rate as small as < 0.5 N s(-1) was used, whi
ch is beneficial for accurate measurement of the fracture strength and toug
hness for brittle materials like diamond films. A novel method was employed
to nucleate and accurately control the length of the pre-crack. A speciall
y designed loading fixture was used to ensure that the diamond film sample
was tested in a near-perfect vertical position, as required by the ASTM E39
9 standards. Effects of sample dimensions on the measurement of fracture to
ughness and fracture strength are discussed; it was shown that miniature-si
ze freestanding diamond film samples can be used for the accurate determina
tion of fracture strength and fracture toughness. However, for accurate mea
surement of fracture toughness, the use of pre-cracked diamond film samples
is absolutely necessary. The effect of loading configuration on the measur
ement of fracture strength is discussed in detail. In addition to the frequ
ently reported two loading configurations (with the nucleation and growth s
urface in tension, respectively), a third loading configuration with the ed
ge surface in tension is also discussed. The Weibel modulus was also found
to be strongly dependent on the loading configuration. The significance of
these findings is discussed. (C) 2001 Elsevier Science B.V. All rights rese
rved.