MECHANICAL TESTING OF THIN-FILMS

The extensive use of thin films in the manufacture of microelectronic devices and for protection against wear and corrosion has stimulated c onsiderable interest in their mechanical properties. In this review th e most widely used testing methods of free standing films and of films adherent to their substrates are described. Particular attention is g iven to problems and difficulties experienced with each of the techniq ues. Results obtained by these methods are discussed and critically ex amined.