Thermal and flow analysis of a heated electronic component

Authors
Yang, RJ Fu, LM
Citation
Rj. Yang et Lm. Fu, Thermal and flow analysis of a heated electronic component, INT J HEAT, 44(12), 2001, pp. 2261-2275
Citations number
20
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
ISSN journal
00179310 → ACNP
Volume
44
Issue
12
Year of publication
2001
Pages
2261 - 2275
Database
ISI
SICI code
0017-9310(200106)44:12<2261:TAFAOA>2.0.ZU;2-#
Abstract
This work presents the application of a newly developed numerical method to study the Bow past a heated electronic component. The vortex shedding mech anism is described with the aid of a large-scale flow structure. The Bow st ructure is also presented by streakline distributions. The computed pressur e and heat flux distributions: along the surface of the electronic componen t are discussed. Their relations with the vortex shedding are also presente d. (C) 2001 Elsevier Science Ltd. All rights reserved.