Jk. Lee et al., Erasure below glass-transition temperature of effect of isothermal physical aging in fully cured epoxy/amine thermosetting system, J APPL POLY, 81(2), 2001, pp. 396-404
The erasure below the glass-transition temperature (T-g) of the effect of i
sothermal physical aging (at aging temperature T-a) in a fully cured epoxy/
amine thermosetting system is investigated using the torsional braid analys
is (TBA) dynamic mechanical analysis technique and the differential scannin
g calorimetry (DSC) technique. From the TEA temperature scans, the intensit
y of the localized perturbation of the moduli in the vicinity of the T-a (9
0 degreesC), due to isothermal physical aging, is decreased by heating to b
elow the T-g(T-gx = 177 degreesC), indicating that the physical aging effec
t can be eliminated by heating to below the T-g. The isothermal aging effec
t in the vicinity of the T-a is almost completely eliminated by heating to
50 degreesC above the T-a (i.e., 140 degreesC); however, a competing aging
effect occurs above T-a at higher temperatures during the heating. Erasure
below T-g of the isothermal physical aging effect is inferred from DSC expe
riments from the diminished relaxation enthalpy in the vicinity of the T-g,
which is measured from the difference in areas between the aged (T-a = 150
degreesC) and deaged thermograms. A comparison of the TBA and DSC results
is made. Implications on the heterogeneous nature of the amorphous glassy s
tate of polymers are discussed. (C) 2001 John Wiley & Sons, Inc.