Erasure below glass-transition temperature of effect of isothermal physical aging in fully cured epoxy/amine thermosetting system

Citation
Jk. Lee et al., Erasure below glass-transition temperature of effect of isothermal physical aging in fully cured epoxy/amine thermosetting system, J APPL POLY, 81(2), 2001, pp. 396-404
Citations number
20
Categorie Soggetti
Organic Chemistry/Polymer Science","Material Science & Engineering
Journal title
JOURNAL OF APPLIED POLYMER SCIENCE
ISSN journal
00218995 → ACNP
Volume
81
Issue
2
Year of publication
2001
Pages
396 - 404
Database
ISI
SICI code
0021-8995(20010711)81:2<396:EBGTOE>2.0.ZU;2-J
Abstract
The erasure below the glass-transition temperature (T-g) of the effect of i sothermal physical aging (at aging temperature T-a) in a fully cured epoxy/ amine thermosetting system is investigated using the torsional braid analys is (TBA) dynamic mechanical analysis technique and the differential scannin g calorimetry (DSC) technique. From the TEA temperature scans, the intensit y of the localized perturbation of the moduli in the vicinity of the T-a (9 0 degreesC), due to isothermal physical aging, is decreased by heating to b elow the T-g(T-gx = 177 degreesC), indicating that the physical aging effec t can be eliminated by heating to below the T-g. The isothermal aging effec t in the vicinity of the T-a is almost completely eliminated by heating to 50 degreesC above the T-a (i.e., 140 degreesC); however, a competing aging effect occurs above T-a at higher temperatures during the heating. Erasure below T-g of the isothermal physical aging effect is inferred from DSC expe riments from the diminished relaxation enthalpy in the vicinity of the T-g, which is measured from the difference in areas between the aged (T-a = 150 degreesC) and deaged thermograms. A comparison of the TBA and DSC results is made. Implications on the heterogeneous nature of the amorphous glassy s tate of polymers are discussed. (C) 2001 John Wiley & Sons, Inc.