Critical thickness of high-temperature AlN interlayers in GaN on sapphire (0001)

Citation
Am. Sanchez et al., Critical thickness of high-temperature AlN interlayers in GaN on sapphire (0001), J ELEC MAT, 30(5), 2001, pp. L17-L20
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
5
Year of publication
2001
Pages
L17 - L20
Database
ISI
SICI code
0361-5235(200105)30:5<L17:CTOHAI>2.0.ZU;2-9
Abstract
We analyze by cross-sectional transmission electron microscopy the threadin g dislocation behavior when crossing an AlN intermediate layer in the GaN/A lN/GaN/sapphire system grown by molecular beam epitaxy. Dislocation behavio r is explained calculating critical thickness by applying the Fischer model to an,AlN layer capped with GaN. Due to elastic interaction between straig ht misfit dislocations, the Matthews and Blakeslee model does not explain t he observed dislocation behavior. The understanding of critical thickness i n the studied system permits to select the AlN interlayer thickness that mi nimizes the threading dislocation density in the capped GaN layer.