Temperature rise due to fast-moving dislocations

Citation
Jtm. De Hosson et al., Temperature rise due to fast-moving dislocations, PHIL MAG A, 81(5), 2001, pp. 1099-1120
Citations number
44
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS ANDMECHANICAL PROPERTIES
ISSN journal
13642804 → ACNP
Volume
81
Issue
5
Year of publication
2001
Pages
1099 - 1120
Database
ISI
SICI code
1364-2804(200105)81:5<1099:TRDTFD>2.0.ZU;2-E
Abstract
In this paper, the method of discrete dislocation plasticity (DDP) is exten ded to include explicitly the thermal effects of moving dislocations. In th is manner, localization of heat during fast deformation can be calculated e xactly. The thermal effects included are the thermal dissipation due to dis location drag, the temperature dependence of the drag coefficients themselv es and a temperature-dependent obstacle strength through a simple Arrhenius -type dependence. An analytical solution is presented and the temperature d istribution is calculated using a time-dependent Galerkin finite-element so lution. The two solutions are compared to provide a mutual validation. Then , the stress-strain curves are calculated for Al under simple shear for con stant temperatures of 100, 298 and 900 K. The stress-strain curves reflect the temperature dependence of the drag coefficients, since the deformation takes place at a strain rate of 10(6) s(1), which is well within the drag-c ontrolled regime. Finally, the temperature distributions for Al and Ti are calculated. At 7.5% shear strain, the maximum temperature rise is of the or der of 20 K in Ti. This is orders of magnitude lower than the melting tempe rature, the temperature which has experimentally observed to be reached. It is anticipated that this is caused by crack propagation which will be mode lled by a DDP approach in future work.