Citation
Pl. Liu et Jk. Shang, Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect, SCR MATER, 44(7), 2001, pp. 1019-1023
Citations number
21
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
SCRIPTA MATERIALIA
ISSN journal
13596462
→ ACNP
Volume
44
Issue
7
Year of publication
2001
Pages
1019 - 1023
Database
ISI
SICI code
1359-6462(20010417)44:7<1019:ISOBIC>2.0.ZU;2-D