New photocuring resin using fullerene as a photosensitizer

Authors
Tajima, Y Shigemitsu, Y Arai, H Takeuchi, E Takeuchi, K
Citation
Y. Tajima et al., New photocuring resin using fullerene as a photosensitizer, SYNTH METAL, 121(1-3), 2001, pp. 1167-1168
Citations number
3
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
SYNTHETIC METALS
ISSN journal
03796779 → ACNP
Volume
121
Issue
1-3
Year of publication
2001
Pages
1167 - 1168
Database
ISI
SICI code
0379-6779(20010315)121:1-3<1167:NPRUFA>2.0.ZU;2-W
Abstract
Photo-oxidation induced polycondensation (POP) resin consisting of furan-su bstituted polyimide and fullerene C-60 has been applied to the heat-resista nt photosensitive polymer. The properties of the POP polyimide in terms of curing behavior and thermostability were studied. The results showed that t he photosensitivity of the POP polyimide depended on the post-exposure baki ng (PEB) which enhanced the curing rate of it. It showed excellent thermost ability; the 5 % weight toss temperature of it reached higher than 370 degr eesC even without high temperature annealing.