Chemical interaction at copper/polyaniline interfaces

Citation
H. Ladebusch et al., Chemical interaction at copper/polyaniline interfaces, SYNTH METAL, 121(1-3), 2001, pp. 1317-1318
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
SYNTHETIC METALS
ISSN journal
03796779 → ACNP
Volume
121
Issue
1-3
Year of publication
2001
Pages
1317 - 1318
Database
ISI
SICI code
0379-6779(20010315)121:1-3<1317:CIACI>2.0.ZU;2-L
Abstract
The chemical interaction between copper and the emeraldine salt of polyanil ine as deposited from a commercially produced dispersion has been investiga ted using x-ray photoelectron spectroscopy. On clean copper foil in vacuum the green conductive form remains stable, but upon exposure to air it is tr ansferred within 20 s to the blue non-conductive emeraldine base form and a t the same time Cu gets oxidized to Cu(I). Upon prolonged exposure to air a lso Cu(II) oxide formation is observed. Copper deposited onto the emeraldin e salt of polyaniline does not chemically change the polyaniline and due to the weak metal/polymer interaction initially small copper islands are form ed on the polyaniline which grow in size upon further copper deposition.