New type X-ray mask fabricated using inductively coupled plasma deepetching

The fabrication of X-ray masks is a critical and challenging process in LIG A technique. As inductively coupled plasma (ICP) deepetching appears to be the most suitable source for deep silicon etching, we fabricated a new type X-ray mask using this technique. In comparison with other types of X-ray m asks, the mask we fabricated has the advantages of its low cost and its sim ple fabrication process. Desired microstructures have also been fabricated using this new type X-ray mask in LIGA technique.