Fabrication of ultra-clean copper surface to minimize field emission dark currents

Citation
C. Suzuki et al., Fabrication of ultra-clean copper surface to minimize field emission dark currents, NUCL INST A, 462(3), 2001, pp. 337-348
Citations number
22
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
ISSN journal
01689002 → ACNP
Volume
462
Issue
3
Year of publication
2001
Pages
337 - 348
Database
ISI
SICI code
0168-9002(20010421)462:3<337:FOUCST>2.0.ZU;2-Q
Abstract
The current from copper electrodes treated by four different types of surfa ce cleaning procedures was measured under DC high field gradient condition. The best results were obtained by using the electrode rinsed with ultra-pu re water after diamond turning. A field gradient of 47 MV/m was achieved wi th dark current at the level of 1 nA, and the microscopic field enhancement factor was estimated to be a very low value of 56. The dark current from t his electrode was dependent only on the field gradient at the cathode and n ot affected by the total voltage applied to the gap. In this case the surfa ce would be covered by a Cu2O layer, which creates few secondary ions by th e electron bombardment. On the other hand, a large total voltage effect and a large vacuum increase were observed for the electro-polished electrode. Cu(OH)I, which would be formed at the copper surface during the electro-pol ishing process, would emit H2O molecules during the electron bombardment. ( C) 2001 Elsevier Science B.V. All rights reserved.