New tools and fabs demand 300mm automation optimization

Automation for 300mm fabs absolutely requires comprehensive attention to th e interrelationships between the four levels of automation: FOUPs and wafer -handling automation, tool frontend automation, intrabay automation, and in terbay automation. The complexity of the manufacturing sequence continues t o grow at a rapid pace, meaning more layers, more vertical circuit integrat ion, and the need for faster feedback from metrology measurement to provide real-time process feed-forward and feed-backward process control.