Nitrogen plasma treatment of the dow Cyclotene 3022 surface and its reaction with evaporated copper

Authors
Yang, DQ Martinu, L Sacher, E Sadough-Vanini, A
Citation
Dq. Yang et al., Nitrogen plasma treatment of the dow Cyclotene 3022 surface and its reaction with evaporated copper, APPL SURF S, 177(1-2), 2001, pp. 85-95
Citations number
38
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
APPLIED SURFACE SCIENCE
ISSN journal
01694332 → ACNP
Volume
177
Issue
1-2
Year of publication
2001
Pages
85 - 95
Database
ISI
SICI code
0169-4332(20010601)177:1-2<85:NPTOTD>2.0.ZU;2-8
Abstract
A N-2 plasma was used to treat the Cyclotene surface so as to introduce N-c ontaining groups, as determined by both XPS and photoacoustic FTIR. High-re solution XPS has confirmed that at least one such group reacts with the Cu to form strong N-Cu bonds. These bonds enhance the adhesion of deposited Cu substantially over either untreated or Ar+-treated Cyclotene. As well, the y eliminate the surface diffusion of Cu clusters formed on deposition, even at 350 degreesC. (C) 2001 Elsevier Science B.V. All rights reserved.