M. Nakamura et al., Characterization of TiOx film prepared by plasma enhanced chemical vapor deposition using a multi-jet hollow cathode plasma source, APPL SURF S, 175, 2001, pp. 697-702
The high rate deposition of Tig, film at low temperature was achieved by pl
asma enhanced chemical vapor deposition (PECVD) using titanium tetraisoprop
oxide (TTIP) as a source material. The multi-jet hollow cathode plasma sour
ce was used to generate the high-density plasma. which was showered toward
the substrate. The emission spectra suggest that oxygen radicals play an im
portant role for dissociation of the source material and for yielding the p
recursors. The high deposition rate up to 50 nm/min was achieved by this pr
ocess.
The as-deposited films are completely amorphous. They consist of structures
with complex bondings including both tetrahedral and octahedral components
. Though they have such complex bondings, the hydrophilicity of the PECVD f
ilm is excellent comparing to that of the annealed crystalline anatase stru
cture. It seems that the PECVD using the multi-jet plasma source is promisi
ng for fabrication of hydrophilic TiOx films in low-temperature process. (C
) 2001 Elsevier Science B.V. All rights reserved.