M. Aspelmeyer et al., High-resolution x-ray reflectivity study of thin layered Pt-electrodes forintegrated ferroelectric devices, J PHYS D, 34(10A), 2001, pp. A173-A178
The structural interface properties of layered Pt/Ti/SiO2/Si electrodes hav
e been investigated using high-resolution specular and diffuse x-ray reflec
tivity under grazing angles. Currently this multilayer system represents a
technological standard as bottom electrodes for ferroelectric thin-film app
lications. For the electronic and ferroelectric properties of integrated de
vices, the film-electrode interface is of crucial importance. We focused on
Pt 1000 Angstrom /Ti 100 Angstrom /SiO2/Si electrodes prepared under annea
ling conditions as employed in industrial processing, prior to the depositi
on of ferroelectric films. The comparison between annealed and non-annealed
electrodes clearly revealed strong interfacial effects due to interdiffusi
on and oxidation of Ti, especially at the Pt-Ti interface. Migration of Ti
into the Pt layer results in a shift of the critical angle due to the enclo
sure of TiO2-x within the Pt layer. The heterogeneous distribution of TiO2-
x, suggests a diffusion mechanism mainly along the Pt grain boundaries. At
the SiO2 interface a relatively weakly oxidized Ti layer of 20 Angstrom rem
ained, which is most probably correlated with the remaining adhesion to the
substrate.