Hygrothermal diffusion behavior in bismaleimide resin

Citation
Ym. Li et al., Hygrothermal diffusion behavior in bismaleimide resin, POLYMER, 42(18), 2001, pp. 7791-7799
Citations number
40
Categorie Soggetti
Organic Chemistry/Polymer Science
Journal title
POLYMER
ISSN journal
00323861 → ACNP
Volume
42
Issue
18
Year of publication
2001
Pages
7791 - 7799
Database
ISI
SICI code
0032-3861(200108)42:18<7791:HDBIBR>2.0.ZU;2-E
Abstract
Hygrothermal diffusion behavior of bismaleimide resin prepared by two diffe rent curing schedules is studied. The Langmuir model is employed to describ e the non-Fickian diffusion behavior observed at two different hygrothermal conditioning temperatures. Dynamic mechanical analysis, attenuated-total-r eflectance Fourier transform infrared spectroscopy and swelling experiments were conducted to investigate the nature of the diffusion process. The exp erimental findings reveal that both hydrogen bonding and the nature of the network architecture strongly affect the hygrothermal diffusion behavior of the bismaleimide resin. The possible diffusion mechanisms accounted for su ch a non-Fickian diffusion behavior are discussed. (C) 2001 Elsevier Scienc e Ltd. All rights reserved.