Bending and twisting of cylindrical solder interconnections with creep

An exact analysis is presented of the creep deformation of cylindrical sold er interconnects subjected to the actions of bending moments, twisting mome nts, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts show the inter actions of the relevant variables, i.e. interconnect geometry: solder mater ial properties; axial force: bending moment; twisting moment: bending stres s; shearing stress: curvature rate: and twist rate. In the results presente d the Garofalo-Arrhenius steady-state creep equation is used to provide the constitutive relationship for SnPb36Ag2 solder interconnects.