E. Ma et Wa. Anderson, MECHANISM OF STABILIZING RUO2 TA2N DOUBLE-LAYER THIN-FILM RESISTORS/, Materials science & engineering. B, Solid-state materials for advanced technology, 47(2), 1997, pp. 161-166
RuO2/Ta2N double layer thin film resistors (D-TFR) may be tuned to pos
sess a near-zero temperature coefficient of resistance (TCR) over a te
mperature range of 100-400 degrees C. It has been shown by Auger elect
ron spectroscopy (AES), electron spectroscopy for chemical analysis (E
SCA), and cross-section transmission electron microscopy (XTEM) that a
distinct layered structure along with an interfacial layer exists in
the RuO2/Ta2N double layer thin film resistor. Chemically, the interfa
cial layer is a ruthenium tantalum nitro-oxide, although there is a co
mposition gradient for each element as proven by the AES depth profili
ng. By inserting different intermediate barrier layers in between the
two resistive layers, the effects of the ruthenium-rich interfacial la
yer was deduced to be decisive in determining the temperature coeffici
ent of resistance tuning process. This leads to an understanding of th
e mechanism responsible for zero or near-zero TCR. (C) 1997 Published
by Elsevier Science S.A.