Measurement of thermal expansion coefficient of flexible substrate by moire interferometry

Authors
Han, B Wu, Z Cho, S
Citation
B. Han et al., Measurement of thermal expansion coefficient of flexible substrate by moire interferometry, EXP TECH, 25(3), 2001, pp. 22-25
Citations number
10
Categorie Soggetti
Mechanical Engineering
Journal title
EXPERIMENTAL TECHNIQUES
ISSN journal
07328818 → ACNP
Volume
25
Issue
3
Year of publication
2001
Pages
22 - 25
Database
ISI
SICI code
0732-8818(200105/06)25:3<22:MOTECO>2.0.ZU;2-F