Dha. Blank et al., CHARACTERIZATION OF MULTILAYER RAMP-TYPE REBA2CU3O7-DELTA STRUCTURES BY SCANNING PROBE MICROSCOPY AND HIGH-RESOLUTION ELECTRON-MICROSCOPY, Journal of alloys and compounds, 251(1-2), 1997, pp. 206-208
We studied the morphology of ramps in REBa2CU3O7 (REBCO) epitaxial fil
ms on SrTiO3 substrates, fabricated by RF magnetron sputter deposition
and pulsed laser deposition (PLD), by scanning probe microscopy (SPM)
and high resolution electron microscopy (HREM). The ramps were fabric
ated by Ar ion beam etching using masks of standard photoresist and TI
N. AFM-studies on ramps in sputter deposited films show a strong depen
dence, i.e. formation of facets and ridges, on the angle of incidence
of the ion beam with respect to the substrate surface as well as the r
otation angle with respect to the crystal axes of the substrate. Ramps
in pulsed laser deposited films did not show this dependence, Further
more, we studied the effect of an anneal step prior to the deposition
of barrier layers (i.e. PrBa2CU3O7, SrTiO3, CeO2) on the ramp. First r
esults show a recrystallization of the ramp surface, resulting in terr
aces and a non-homogeneous growth of the barrier material on top of it
. The thickness variations, for thin layers of barrier material, con e
ven become much larger than expected from the amount of deposited mate
rial and are dependent on the deposition and anneal conditions. HREM s
tudies show a well defined interface between barrier layer and electro
des. The angle of the ramp depends on the etch rate of the mask and RE
BCO, and on the angle of incidence of the ion beam. TiN has a much low
er etch rate compared to photoresist, resulting in an angle of the ram
p comparable to the angle of incidence, resulting in a low etching rat
e on the ramp. These results will lead to improved electrical characte
ristics of ramp-type junctions.