A study of compact thermal model topologies in CFD for a flip chip plasticball grid array package

A previously validated detailed model of a 119-pin flip-chip plastic ball g rid array (FC-PBGA) package was created and validated against experimental data for natural convection and forced Convection environments, Next, two c ompact models were derived, a two-resistor model (created using the JEDEC-s tandard based computational approach), and a multiresistor model (created u sing the DELPHI optimization approach that was boundary condition independe nt within engineering accuracy). The compact models were placed in natural convection and forced convection (velocities of 1 and 2 m/s) environments w ith and without a heatsink, Based on the agreement obtained between the det ailed model and compact model simulations, the accuracy and validity of the two compact models was assessed. Of the two compact thermal models conside red, the Delphi multiresistor model provided the same predictive estimates (within 5%) as simulations involving a detailed thermal model of the packag e in natural and forced convection environments both with and without attac hed heatsinks, Some thermal modeling issues were addressed with respect to implementation of compact thermal models with attached heatsinks.