RF electrical measurements sf fine pitch BGA packages

A series of fine pitched ball grid arrays (BGAs) were measured on an Networ k Analyzer using a novel technique to de-embed the package test fixture and provide an accurate representation of the electrical characteristics of th e package, The technique consisted of the design and fabrication of a RF ci rcuit board. Duplicates of the board were modified to become a series of ca libration fixtures while others, with sample packages attached, were modifi ed to become test fixtures. The packages, attached to circuit boards, were measured to determine their performance at the RF frequencies of most cellu lar phone applications. Measurements included the return losses looking int o several leads of the package that were 50 Omega terminated and insertion losses from one terminated lead to an adjacent one. These measurements can be used for verifying models or for characterizing packages.