A series of fine pitched ball grid arrays (BGAs) were measured on an Networ
k Analyzer using a novel technique to de-embed the package test fixture and
provide an accurate representation of the electrical characteristics of th
e package, The technique consisted of the design and fabrication of a RF ci
rcuit board. Duplicates of the board were modified to become a series of ca
libration fixtures while others, with sample packages attached, were modifi
ed to become test fixtures. The packages, attached to circuit boards, were
measured to determine their performance at the RF frequencies of most cellu
lar phone applications. Measurements included the return losses looking int
o several leads of the package that were 50 Omega terminated and insertion
losses from one terminated lead to an adjacent one. These measurements can
be used for verifying models or for characterizing packages.