Sx. Ling et al., Evaluating and implementing commercial processes for producing reliable, cost-effective miniaturized space electronics, J H APL TEC, 22(2), 2001, pp. 144-154
Implementing commercial processes into the design of space electronics is a
desirable, cost-effective way to leverage existing advanced packaging tech
nologies derived from consumer electronics products. Demands for faster, be
tter, lighter, and cheaper products have led to many innovative designs in
commercial electronics, most noticeably in the telecommunications sector. B
ut directly employing commercial processes in space applications, although
cost-effective, is extremely risky. Therefore, careful studies and planning
are critical to ensure the survivability of commercial processes throughou
t the space mission and full functionality under severe space environments.
With many years of experience in developing high-reliability electronics,
the APL Space Department began evaluating, qualifying, and developing comme
rcial processes for space applications with chip-on-board (COB) technology
We have successfully demonstrated that our in-house fabrication and coating
process can improve existing commercial COB technology to meet the stringe
nt qualifications for space environments. Recently, we have focused on adva
nced interconnect methods such as flip chip technology and high-density pri
nted wiring board development with blind and buried micro vias. These ongoi
ng studies have demonstrated great potential for future space applications
for both one-of-a-kind and build-to-print production runs.