Modelling of through-hole electrodeposition - Part II: Experimental study

Authors
Chan, SH Cheh, HY
Citation
Sh. Chan et Hy. Cheh, Modelling of through-hole electrodeposition - Part II: Experimental study, J APPL ELEC, 31(6), 2001, pp. 617-622
Citations number
5
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
JOURNAL OF APPLIED ELECTROCHEMISTRY
ISSN journal
0021891X → ACNP
Volume
31
Issue
6
Year of publication
2001
Pages
617 - 622
Database
ISI
SICI code
0021-891X(2001)31:6<617:MOTE-P>2.0.ZU;2-B
Abstract
Current distribution measurements in through-hole electrodeposition were ma de on sectioned copper electrodes in a cylindrical flow channel. Two copper plating solutions with the same copper sulfate concentration but with diff erent sulfuric acid concentrations were used. Experiments were conducted po tentiostatically and under steady-state conditions. Results were compared w ith those from the theoretical model.