Topographic study of sputter-deposited film with different process parameters

Citation
Sp. Ju et al., Topographic study of sputter-deposited film with different process parameters, J APPL PHYS, 89(12), 2001, pp. 7825-7832
Citations number
31
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
89
Issue
12
Year of publication
2001
Pages
7825 - 7832
Database
ISI
SICI code
0021-8979(20010615)89:12<7825:TSOSFW>2.0.ZU;2-P
Abstract
In this study, molecular dynamics simulation is employed to investigate the surface topography of thin films produced by the sputtering process for di fferent parameters such as substrate temperature, incident energy, and inci dent angle. Interface width is used to quantify the quality of the deposite d film. The Morse potential is used to model the atomic interaction between atoms. From the results of this study, it is found that for lower substrat e temperature, lower incident energy, and larger incident angle, the growin g film structure tends toward a three-dimensional columnar structure, and a rougher film is produced. Conversely, for higher substrate temperature, hi gher incident energy, and smaller incident angle, the growing film structur e tends toward a two-dimensional (Frank-van der Merwe) quasi-layer-by-layer structure, and a smoother film is produced. Finally, average surface kinet ic energy is found to be an important factor in determining the surface pro perties produced in the process. Generally, the produced film is smoother w hen the average surface kinetic energy is larger. (C) 2001 American Institu te of Physics.